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    Aug 16, 06:41
    Samsung, SK Hynix HBM4 hiring war drains South Korea's chip design talent
    Aug 16, 06:41
    China's AI supernode build-out turns more chips into more computing power
    Aug 16, 06:39
    TV slowdown accelerates panel makers' shift to IT OLED, UBI Research found
    Aug 16, 06:41
    Interview: Orbbec bridges physical AI data gaps with robot-free platform
    Aug 15
    Interview: Acrab CEO Ken Phua on building agentic AI silicon in Singapore
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    Nan Pao posts record second-quarter profit and July revenue as sales rise
    Aug 16, 06:39
    Edgecore pushes all-optical networking for distributed AI data centers
    Aug 16, 06:39
    Flytech posts record second-quarter profit on AI demand, margin gains
    Aug 16, 06:38
    AI reshapes semiconductor testing as KYEC pushes four-way model
    Aug 16, 06:38
    AI product cycle lifts Chroma test demand
    HDRE reports first-half growth as Japan and Australia projects expand
    Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer
    Taiwan Gold Card approvals for finance professionals top 1,000
    Acer COO Jerry Kao resigns; Chairman Jason Chen to fill role
    Taiwan Mobile launches tender offer for Systex, targeting majority control
    Asia Vital Components sees stronger AI server demand and faster liquid cooling adoption
    Research Insight: Unitree IPO reveals humanoid robot commercialization still in early innings
    J&V Energy lifts 1H revenue on storage and green power trading
    Lotes sees tight supply, says demand remains intact
    Century Group pivots beyond offshore wind with four-pronged energy strategy
    Tripod posts record second-quarter margins on strong server and memory demand
    MicroIP sees second-half revenue lift as board approves cash raise
    Taiwan offshore wind lifts marine engineering and ocean industry output
    Taiwan approves NT$8 billion ocean tech program for security and industry
    Research insight: Delta, Lite-on raise capex to 9% of revenue in AI data center power race
    Memory supply crunch pushes long-term contracts beyond the big three
    AI server tracker: Demand drives July revenue gains across Taiwan infrastructure suppliers
    SK hynix scouts US memory fab sites as customers seek local supply
    South Korea chip cluster could expand to nine fabs as SK plans new investment
    China AI chip demand lifts Hygon revenue 67%, Sugon profit 34% as domestic computing expands
    Alibaba Cloud's 6-year evolution: five super data centers pivoting to AI compute
    South Korea's memory-chip exports surge 277% as system chips slip
    OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?
    Global PMX sees semiconductor demand driving growth through 2027 as product mix shifts
    Alibaba Cloud races ahead with Ulanqab AI infrastructure
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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    Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
    OCP APAC Summit 2026
    The OCP APAC Summit 2026 takes place August 11-12 at the TaiNEX2 exhibition hall in Taipei.
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    EV
    Wednesday 29 July 2026
    Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
    Chinese automakers gain share in Europe as legacy carmakers partner to cut costs
    Friday 14 August 2026
    Global PMX sees semiconductor demand driving growth through 2027 as product mix shifts
    Friday 14 August 2026
    Porsche exits Volkswagen carbon pool, joins Xpeng
    Friday 14 August 2026
    TECH
    Friday 14 August 2026
    OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?
    OCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory
    Thursday 13 August 2026
    OCP APAC 2026: Microsoft leans on Taiwan supply chain for 'silicon-to-systems' AI buildout
    Wednesday 12 August 2026
    Interview: Nvidia exec on progress of CPO production and pluggable optics
    Friday 7 August 2026
    ASIA
    Thursday 30 July 2026
    China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
    South Korea's memory-chip exports surge 277% as system chips slip
    Friday 14 August 2026
    VinSpace signs SpaceX launch deal for first satellites in 2027
    Friday 14 August 2026
    DeepSeek raises API prices sharply as V4 Pro targets agentic AI market
    Friday 14 August 2026
    OPINIONS
    Friday 14 August 2026
    Insight: Intel raises US$20B, but its 14A ambitions may need twice as much
    Analysis: Taiwan Mobile takes control of Systex to close ICT gap with Chunghwa Telecom, Far EasTone
    Friday 14 August 2026
    Analysis: Google's Pixel tests Android's competitive balance
    Friday 14 August 2026
    Interview: 'Modern warfare is a battle of PAs'–Transcom targets overseas defense, LEO satellite growth
    Friday 14 August 2026
    TOPICS
    OCP APAC SUMMIT 2026
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    Friday 14 August 2026
    AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
    AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
    Thursday 13 August 2026
    Taiwan notebook industry, 2Q 2026
    Taiwan notebook industry, 2Q 2026
    Tuesday 11 August 2026
    AI infrastructure moves toward scale-across; demand for coherent optics supply chain heats up
    AI infrastructure moves toward scale-across; demand for coherent optics supply chain heats up
    Thursday 6 August 2026
    Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments
    Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments