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REALTIME NEWS
Commentary: Nvidia's NVLink licensing reshapes semiconductor alliance, potential thaw with Broadcom
Tomorrow's Headlines
9h 14min ago
China's auto market faces long-term internal competition led by 30 core manufacturers in 2026
Tomorrow's Headlines
9h 14min ago
Middle East conflict drives up electronic industry costs and delays
Tomorrow's Headlines
9h 14min ago
Chinese automakers adopt smartphone-style R&D to challenge traditional joint venture models
Tomorrow's Headlines
9h 14min ago
OpenClaw China mirror launched amid ByteDance and Tencent competition
Tomorrow's Headlines
9h 14min ago
US PIPIR launches dual-track drone and missile strategy with Taiwan's non-China supply chain advantage
Tomorrow's Headlines
9h 14min ago
Apr 2, 15:45
COMPLIMENTARY
SpaceX files for IPO, setting stage for potential US$1.75 trillion valuation
Apr 2, 15:18
South Korea reportedly advances GaAs localization with 95% yield on 4-inch process
Apr 2, 15:20
Copper price surge drives quarterly lead frame price hikes
Apr 2, 15:11
Samsung reportedly supplies Exynos modem chips to Fibocom for 5G module mass production
Apr 2, 15:02
South Korea exports hit record US$86bn, chip demand drives breakout above US$80bn
LATEST STORIES
7 days news
France backs Taiwan's ProLogium with EUR1.5B subsidy to build solid-state battery factory
Apr 2, 12:39
ELECTRIC VEHICLES
Mobile chip inventory correction weighs on OSAT supply chain
Apr 2, 11:49
COMMUNICATIONS
Samsung raises prices on select 2025 flagship smartphones as chipflation and currency bite
Apr 2, 11:48
COMMUNICATIONS
Samsung upgrades Austin fab, signals dual-track US chip strategy
Apr 2, 11:23
SEMICONDUCTORS
Wiwynn taps optics chief to deepen CPO push for AI servers
IBM and Arm collaborate on dual‑architecture hardware to broaden enterprise AI deployment
Precious metal surge drives price hikes for frequency components at TXC and Tai-Saw
Taiwan car market shows structural shifts, with Tesla deliveries surging
Intel expands SambaNova stake, governance questions surface
Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance
Samsung ramps Texas fab as engineers gather for 2nm push
Topco maintains stable shipments despite Middle East conflict, builds safety stock as AI demand accelerates
TCL acquires majority stake in Sony's home entertainment business in a strategic global JV
Ajinomoto faces stakeholder pressure to raise ABF prices
Up Young targets double-digit revenue growth in 2026 through business and brand expansion
Nvidia invests US$2 billion in Marvell to integrate NVLink Fusion with ASICs
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM
TSMC's US expansion held ransom as JASM takes flight
South Korea's market volatility hands Taiwan a rare edge in AI
Chinese companies capture nearly 41% of domestic AI accelerator server market
Commentary: What's the real game behind Arm's chip venture?
Dixon launches India's first homegrown display module fab with broad capacity expansion
Opportunity in DeepSeek's turbulence: Z.ai sets sight on 'Chinese Anthropic' with API, token strategy
The ascension of Arm: hyperscalers rewire AI server CPUs for the post-x86 era
TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active
Microsoft bets US$6.5 billion on Southeast Asia AI buildout, spanning Singapore and Thailand
Deep dive: Huawei 2025 annual report reveals why its AI strategy starts with infrastructure
Boom turns cautious: Mexico reassesses its embrace of Chinese cars
Notebook shortages persist despite rumors of easing memory prices
Intel buyback signals shift beyond austerity as chipmaker regains confidence
BIZ FOCUS
Feb 9, 08:00
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
MOST-READ
TSMC leads foundry price hikes as second-tier firms see profit rebound
Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch
HBM4 showdown at GTC 2026: SK Hynix, Samsung, and Micron battle for AI memory supremacy
Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment
Micron: LPDRAM server demand to outpace market; Taiwan key production base
AI compression won't ease memory crunch, NAND shortage set to persist
DRAM prices surge 180% as HBM competition shifts to profitability
MULTIMEDIA
CEA-Leti CEO in Taipei
SEMICON China 2026
SEMICON China 2026 took place from March 25 to 27, 2026, at the Shanghai New International Expo Centre (SNIEC).
Semicon China 2026: AI drives semiconductor market to US$1.8 trillion by 2030, China leads capacity and equipment
Semicon China 2026: AI efficiency fuels demand growth under Jevons paradox, AMD warns
Semicon China 2026: Siemens EDA pushes agentic AI to cut chip design cycles in half
...More
EV
Monday 2 March 2026
Europe's battery industry faces strategic setback as high costs and technology gaps cede ground to Asian rivals
France backs Taiwan's ProLogium with EUR1.5B subsidy to build solid-state battery factory
Thursday 2 April 2026
Taiwan car market shows structural shifts, with Tesla deliveries surging
Thursday 2 April 2026
Boom turns cautious: Mexico reassesses its embrace of Chinese cars
Thursday 2 April 2026
TECH
Thursday 26 February 2026
Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
Deep dive: Huawei 2025 annual report reveals why its AI strategy starts with infrastructure
Thursday 2 April 2026
Exclusive: Inside GlobalFoundries CEO's stealth Taiwan blitz: wafer deals, not a UMC takeover
Friday 13 March 2026
TSMC reveals dual purpose behind Chiayi AP7 plant as Yunlin expansion looms
Friday 23 January 2026
ASIA
Monday 2 March 2026
Renesas names new India president to accelerate growth amid fierce engineering talent competition
TSMC's US expansion held ransom as JASM takes flight
Thursday 2 April 2026
South Korea reportedly advances GaAs localization with 95% yield on 4-inch process
Thursday 2 April 2026
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM
Thursday 2 April 2026
OPINIONS
Monday 2 March 2026
Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia
Commentary: What's the real game behind Arm's chip venture?
Thursday 2 April 2026
Deep dive: Huawei 2025 annual report reveals why its AI strategy starts with infrastructure
Thursday 2 April 2026
Column: How US states are rolling out red carpet for drone makers
Thursday 2 April 2026
TOPICS
SEMICON CHINA 2026
IOT
5G
TRENDS IN INDUSTRIAL COMPUTING
SPECIAL REPORTS
Thursday 2 April 2026
Benefits of CXL in server memory configuration
General-purpose server demand on the rise in 2026; continuous memory cost increases expected to drive CXL demand.
Wednesday 1 April 2026
Notebook shipment update, February 2026
February 2026 notebook industry observation: Capacity sharply reduced during the Lunar New Year holidays, and component shortage persists; shipments of the top five notebook brands decrease 5% month-on-month.
Monday 30 March 2026
Taiwan wafer foundry industry, 1Q 2026 and 2026 forecast
Taiwan foundry revenue growth expected to reach 30% 2026; strategic adjustments initiated for mature processes.
Tuesday 24 March 2026
SDV deployment of auto Tier-1 and processor players
Software-defined vehicles (SDVs) enter the accelerated deployment era; integration of AI models by automotive processor players becomes an inevitable direction.
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