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Aug 1, 01:57
At OCP's Taiwan summit, servers take a back seat to optics and advanced packaging
Jul 31
Elon Musk denies rumored Tesla China contingency plans; discussions on supply chain localization shifts persist
Jul 31
Analysis: The AI buildout stopped being a demand story
Jul 31
Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap
Jul 31
TSMC reportedly develops EMIB-like packaging to counter Intel
LATEST STORIES
7 days news
Powerchip founder Frank Huang dies at 76; vice chair steps in as acting chief
Jul 31
SEMICONDUCTORS
Lite-On expands InP optical push with US$34.3 million stake in Singapore's DenseLight
Aug 1, 00:35
ICT
MJ Taiwan names Maverick Shih chair, prioritizes AI, cybersecurity and space technologies
Jul 31
ICT
Exclusive: Asian chipmakers' shift to US helium raises concentration risk
Jul 31
EAST ASIA
AWS backlog reaches US$496 billion; Amazon to double power capacity by end-2027
AIT reassures Taiwan-US auto ties remain strong amid ongoing tariff debate
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
Delta Electronics eyes HVDC shipments in 4Q26, scale-up in 2027
Exclusive Interview: Helium shock threatens advanced chipmaking as Asia shifts dependence to the US
ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027
Amazon's Zoox receives US approval for commercial deployment of robotaxis
ByteDance merges Lark with Doubao after AI revenue hits US$4B run rate
Pegatron chair says AI outlook remains strong, calls for Taiwan application push
Thunder Tiger calls for budget clarity as Taiwan pushes uncrewed surface vessel development
US CSP leaders keep capex growth as AI monetization deepens
Jensen Huang's open-source push signals a fight over who controls the AI market
Anthropic discloses AI testing breach days after OpenAI incident, raising scrutiny of autonomous agents
Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
Analysis: Behind Microsoft's AI strategy to sharpen platform edge
Tokyo Electron raises outlook as AI data center spending lifts memory demand
Powertech bets on AMD FOPLP mass production in 2027
Amazon Leo nears 400 satellites, initial service to begin this year
Auto chip demand recovers, but restocking remains elusive
EU launches AI Gigafactories call to boost Europe's computing capacity
Rising smartphone prices are reshaping purchase plans in India
Memory shortages deepen as prices climb into the second half of 2026
Amazon lifts 2026 capex to US$220 billion, pins the increase on memory prices
Shanghai rises as China's lithography hub, powered by SMEE, Huawei and rising DUV rivals
Kioxia begins sampling 1TB 3D flash memory for AI devices
India's first telecom manufacturing zone to land in Madhya Pradesh
More news
BIZ FOCUS
Jul 30, 08:00
EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
Monday 1 June 2026
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
Thursday 30 July 2026
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
Wednesday 29 July 2026
Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
MOST-READ
Samsung eyes marquee AI win as Anthropic explores custom chip beyond Nvidia
Haesung DS lands CXMT as DDR5 substrate customer, weighs panel production for DDR6
Micron and GM strike long-term memory supply deal for vehicles
Samsung struggles to secure AI chip substrates, report says
Intel takes aim at TSMC's CoWoS lead with EMIB-T
Memory shortage could turn into a glut by 2028 as chipmakers expand
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
2026 Kumamoto Earthquake
A powerful earthquake struck Japan's Kyushu region at 4:27 pm on July 28. The Japan Meteorological Agency initially estimated the quake at magnitude 7.1 with a depth of 6.2 miles (10 kilometers).
Kumamoto quake exposes Kyushu auto supply-chain fault lines
TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes
Kumamoto quake hits electronics cluster, but impact remains concentrated in inspection-related stoppages
...More
EV
Wednesday 29 July 2026
Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
Elon Musk denies rumored Tesla China contingency plans; discussions on supply chain localization shifts persist
Friday 31 July 2026
Amazon's Zoox receives US approval for commercial deployment of robotaxis
Friday 31 July 2026
Auto chip demand recovers, but restocking remains elusive
Friday 31 July 2026
TECH
Friday 31 July 2026
Amazon lifts 2026 capex to US$220 billion, pins the increase on memory prices
SK Hynix sees record-breaking 2Q on surging AI demand
Wednesday 29 July 2026
Nvidia remaps Asia's AI supply chain, raising fresh questions over Taiwan's edge
Tuesday 28 July 2026
AMD's latest 2nm-EPYC rollout signals broader role for CPUs in the AI data center
Friday 24 July 2026
ASIA
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
Exclusive: Asian chipmakers' shift to US helium raises concentration risk
Friday 31 July 2026
Elon Musk denies rumored Tesla China contingency plans; discussions on supply chain localization shifts persist
Friday 31 July 2026
Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
Friday 31 July 2026
OPINIONS
Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy
Analysis: The AI buildout stopped being a demand story
Friday 31 July 2026
Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap
Friday 31 July 2026
Analysis: Behind Microsoft's AI strategy to sharpen platform edge
Friday 31 July 2026
TOPICS
2026 KUMAMOTO EARTHQUAKE
TSMC UPDATES
GEOWATCH
HUAWEI
SPECIAL REPORTS
Friday 31 July 2026
China smartphone market and industry, 2Q 2026
China smartphone market and industry, 2Q 2026: 2H26 shipments to drop by over 30% YoY
Friday 24 July 2026
TGV still faces technical barriers; CoPoS commercialization not likely until 2030
TGV still faces technical barriers; CoPoS commercialization not likely until 2030
Monday 13 July 2026
Huakun deepens server cooperation with Huawei, targets overseas growth through on-premise AI applications
Huakun deepens server cooperation with Huawei, with clients already in ASEAN, Central Asia, and South Asia. The company targets overseas growth through on-premise AI applications.
Thursday 9 July 2026
Notebook shipment update, May 2026
In May 2026, combined shipments from the top five notebook brands increased by approximately 8% month-over-month. However, shipments by brand vendors were still down about 6% compared with May 2025.
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