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REALTIME NEWS
How UC Santa Cruz's Silicon Valley lab is reverse-engineering the human brain to solve AI's chip power crisis
Semiconductors
2min ago
Silicon Valley goes physical: how San Jose is building an energy-rich, tariff-mitigated capital for physical AI
ICT
7min ago
Inside UC San Diego's 'Made with Taiwan' push to train TSMC's future engineers, reinvent chip packaging
Semiconductors
7min ago
Smartphone lens shipments lift Genius Electronic Optical revenue 12% in August
Communications
10min ago
Sep 7, 10:00
India says it cannot build electronics without China and has started easing the rules to prove it
Sep 7, 07:43
Every Chinese CPU maker grew in 1H26 but only one grew on processors
Sep 7, 10:52
Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV
Sep 7, 07:43
Orphans of the liquid cooling age: xMEMS targets data center 'hot spots,' eyes 2027 smartphone and smartglasses cooling ports
Sep 7, 07:42
Dark fab cybersecurity: Why autonomous manufacturing needs zero trust
LATEST STORIES
7 days news
Smartphone lens shipments lift Genius Electronic Optical revenue 12% in August
Sep 7, 17:01
COMMUNICATIONS
HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days
Sep 7, 16:57
EAST ASIA
Huawei Kirin 9050 Pro revives flagship chip launches with reported LogicFolding architecture in Mate XT 2
Sep 7, 16:54
EAST ASIA
STMicroelectronics says humanoid robots must clear a trio of hurdles
Sep 7, 16:47
ICT
Exclusive: Infineon Dresden fab to hit full capacity in 2-3 years, COO says
India frames its chip build-out as redundancy for the world, and Taiwan as its partner in building it
SEMICON Taiwan 2027 moves to August, aligning with TSMC's 40th anniversary
Kian Shen lifts Taiwan mix as China exports gain traction
Yaho rides TSMC, Micron expansion wave to tap facility integration, equipment installation market
Model fatigue, China's price pressure, and a profit horizon still years away
Inside K-Safety Expo 2026: AI is disappearing into safety — and that changes everything
Exclusive: Infineon COO says chip shortage recovery will take longer
Phison snaps up low-cost China NAND inventory, AI revenue share set to top 40%
NEC reportedly ends quantum computer hardware development, shifts focus to annealing
DeepSeek plans to buy 160,000 Huawei chips as China aims to wean itself off Nvidia
Micron scores seventh PTAB win in YMTC patent fight
China's power battery sector maintains strong growth momentum as global market presence expands
Exclusive: Taipower's new green power sandbox could ease TSMC's surplus electricity problem
Xiaomi warns of more India price hikes as AI squeezes the phone from both sides
Analysis: Under tariff threats, Taiwan chipmakers hedge beyond US
SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E
India's TCS unit secures land in Hyderabad for planned 1GW AI data center campus
Foxconn revenue climbs on AI server demand, outlook improves
Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
Experts say subsidies can't buy semiconductor competitiveness
India roundup: India expands chip ambitions with full Semicon 2.0 notification
JM-Applied sees gas equipment demand surge on AI expansion, order book exceeds NT$3 billion
Anthropic IPO set to put AI governance under public-market scrutiny
Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
Chicony Power's August revenue dips as AI server and satellite demand strengthens
More news
BIZ FOCUS
Sep 2, 08:22
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
Wednesday 2 September 2026
DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs
MOST-READ
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
Update: ABF substrate maker Unimicron searched in origin-labeling probe
SK keyfoundry expands 8-inch capacity as China demand strains supply
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
Semicon Taiwan 2026
Semicon Taiwan 2026 took place on September 2-4, 2026, at TaiNEX 1&2, Taipei, with the event tagline of "Transform Tomorrow".
India frames its chip build-out as redundancy for the world, and Taiwan as its partner in building it
SEMICON Taiwan 2027 moves to August, aligning with TSMC's 40th anniversary
Exclusive: Infineon COO says chip shortage recovery will take longer
...More
EV
Wednesday 2 September 2026
China moves to curb overseas price wars as automakers accelerate global expansion
Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains
Friday 4 September 2026
Xiaomi Auto maps 2027 Europe entry with German dealer network and four-country vehicle testing
Friday 4 September 2026
Acer broadens lineup with e-paper displays and scooters, ahead of PC industry headwinds
Friday 4 September 2026
TECH
Friday 4 September 2026
TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
Chinese court freezes US$318M in Nexperia assets, further escalating corp rift
Tuesday 1 September 2026
The architect of Apple's China machine also built its hardest problem
Monday 31 August 2026
Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market
Wednesday 26 August 2026
ASIA
Thursday 3 September 2026
CXMT's 'Hefei Project' exposed in Samsung DRAM theft case
China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls
Friday 4 September 2026
Samsung turns to chips, OLED for next phase of Vietnam expansion
Friday 4 September 2026
Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Friday 4 September 2026
OPINIONS
Tuesday 1 September 2026
Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap
Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground
Tuesday 1 September 2026
Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
Tuesday 1 September 2026
Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race
Tuesday 1 September 2026
TOPICS
SEMICON TAIWAN 2026
HUAWEI
TSMC UPDATES
GEOWATCH
SPECIAL REPORTS
Wednesday 2 September 2026
Global smartphone industry, 2Q 2026
According to DIGITIMES, smartphone memory contract prices surged by 50% to 80% in the first half of 2026, prompting most vendors to continue cutting shipments of mid- and low-end models and to raise product prices.
Friday 28 August 2026
AI data center 800VDC power architecture takes shape; future hurdles require balancing multiple key factors
DIGITIMES believes that 2026 will be a pivotal year in the stabilization of 800VDC power architectures for AI data centers.
Wednesday 26 August 2026
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued to rise.
Tuesday 25 August 2026
Chinese automakers expand to humanoid robotics with technology, supply chain and scenario advantages
DIGITIMES observes that the humanoid robot market is expanding rapidly, supported by global labor shortages and advances in artificial intelligence (AI), and Chinese automakers are also moving aggressively into this emerging field.
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