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Aug 17, 07:54
India roundup: India's electronics push gains momentum as water, China ties and chip incentives collide
Aug 17, 08:53
Modi pledges more chip plants, mass AI training, and an export push in Independence Day address
Aug 17, 08:52
LG, Nvidia deepen ties on humanoid robots, AI factories, and vehicles
Aug 17, 07:54
AI server tracker: Demand drives strong growth across Taiwan's CCL, design services, substrate, and testing supply chains
Aug 17, 07:51
T-glass demand surges as IC substrate makers see shortages through 2028
LATEST STORIES
7 days news
Appier lifts FY26 outlook after record second-quarter revenue and margin gains
Aug 17, 07:50
ICT
China's AI supernode build-out turns more chips into more computing power
Aug 16
ICT
OCI thins solar wafers to boost Vietnam output 39%
Aug 17, 07:54
SOUTHEAST ASIA
Twoway Communications speeds defense push with C-UAS, unmanned vehicles
Aug 17, 07:53
AEROSPACE
AI vision sensing demand heats up for Novatek, PixArt, Elan, Realtek
DFI accelerates edge AI rollout in 2H26 with ‘Right Compute’ strategy
FSC plans MLPC trial production by end-2026 in passive component push
Toppan eyes FC-BGA substrate price hikes as new line fills up
E Ink cuts 2026 outlook as signage gains momentum
Fu Chun Shin lifts second quarter margins on stronger electronics demand
Solomon posts record 2Q26 profit as AI vision, robotics orders surge
Gogolook sees 2026 revenue hit new high as anti-fraud businesses expand
Taiwan's Century Group eyes SMR supply chain as AI power demand accelerates
Unique Opto sees AI demand lift 1H26 results, but CPO upside remains uncertain
Sigurd tops NT$2B in July revenue as AI testing demand surges
Samsung, SK Hynix HBM4 hiring war drains South Korea's chip design talent
Interview: Orbbec bridges physical AI data gaps with robot-free platform
Taiwan Mobile launches tender offer for Systex, targeting majority control
Nan Pao posts record second-quarter profit and July revenue as sales rise
Edgecore pushes all-optical networking for distributed AI data centers
TV slowdown accelerates panel makers' shift to IT OLED, UBI Research found
Flytech posts record second-quarter profit on AI demand, margin gains
AI reshapes semiconductor testing as KYEC pushes four-way model
AI product cycle lifts Chroma test demand
HDRE reports first-half growth as Japan and Australia projects expand
Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer
Asia Vital Components sees stronger AI server demand and faster liquid cooling adoption
Taiwan Gold Card approvals for finance professionals top 1,000
Research Insight: Unitree IPO reveals humanoid robot commercialization still in early innings
J&V Energy lifts 1H revenue on storage and green power trading
More news
BIZ FOCUS
Jul 30, 08:00
EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
Monday 1 June 2026
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
Thursday 30 July 2026
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
Wednesday 29 July 2026
Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
MOST-READ
Haesung DS lands CXMT as DDR5 substrate customer, weighs panel production for DDR6
Samsung struggles to secure AI chip substrates, report says
Memory shortage could turn into a glut by 2028 as chipmakers expand
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
2027 memory capacity reportedly sold out as buyers quietly lock in supply
'Don't panic about Kimi K3': Jensen Huang claims everyone got the logic backwards
MULTIMEDIA
Jensen Huang in Seoul: Faker, BBQ and one very awkward LG chairman
OCP APAC Summit 2026
The OCP APAC Summit 2026 takes place August 11-12 at the TaiNEX2 exhibition hall in Taipei.
OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?
Kioxia eyes customer trials for PCIe Gen6 optical SSD
Intel tests system memory to ease AI KV-cache pressure
...More
EV
Wednesday 29 July 2026
Chinese brands seize 25% of Europe midsize SUV sales as BEV demand surges
Chinese automakers gain share in Europe as legacy carmakers partner to cut costs
Friday 14 August 2026
Global PMX sees semiconductor demand driving growth through 2027 as product mix shifts
Friday 14 August 2026
Porsche exits Volkswagen carbon pool, joins Xpeng
Friday 14 August 2026
TECH
Friday 14 August 2026
OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?
OCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory
Thursday 13 August 2026
OCP APAC 2026: Microsoft leans on Taiwan supply chain for 'silicon-to-systems' AI buildout
Wednesday 12 August 2026
Interview: Nvidia exec on progress of CPO production and pluggable optics
Friday 7 August 2026
ASIA
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
South Korea's memory-chip exports surge 277% as system chips slip
Friday 14 August 2026
VinSpace signs SpaceX launch deal for first satellites in 2027
Friday 14 August 2026
DeepSeek raises API prices sharply as V4 Pro targets agentic AI market
Friday 14 August 2026
OPINIONS
Friday 14 August 2026
Insight: Intel raises US$20B, but its 14A ambitions may need twice as much
Analysis: Taiwan Mobile takes control of Systex to close ICT gap with Chunghwa Telecom, Far EasTone
Friday 14 August 2026
Analysis: Google's Pixel tests Android's competitive balance
Friday 14 August 2026
Interview: 'Modern warfare is a battle of PAs'–Transcom targets overseas defense, LEO satellite growth
Friday 14 August 2026
TOPICS
OCP APAC SUMMIT 2026
EMS WATCH
TRENDS IN INDUSTRIAL COMPUTING
IOT
SPECIAL REPORTS
Friday 14 August 2026
AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
Thursday 13 August 2026
Taiwan notebook industry, 2Q 2026
Taiwan notebook industry, 2Q 2026
Tuesday 11 August 2026
AI infrastructure moves toward scale-across; demand for coherent optics supply chain heats up
AI infrastructure moves toward scale-across; demand for coherent optics supply chain heats up
Thursday 6 August 2026
Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments
Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments
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