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REALTIME NEWS
Acer sees CPU shortages worse than memory as 2H24 PC market weakens
Tomorrow's Headlines
7h 14min ago
Grab bets on agentic AI to reshape Taiwan's food delivery market with foodpanda acquisition
Tomorrow's Headlines
7h 14min ago
Huawei’sTau Law breath new air into China's advanced packaging
Tomorrow's Headlines
7h 34min ago
Taiwan's Wah Lee expands into specialty gases as materials costs are passed on quarterly
Tomorrow's Headlines
7h 34min ago
CSP capex surge fuels hot AI server demand and tight supply in 2026
Tomorrow's Headlines
7h 34min ago
Google and Blackstone form AI cloud venture to commercialize TPU capacity
Tomorrow's Headlines
7h 34min ago
Taiwan's SAS breaks out of China's low-price solar trap with space, drone, and marine applications
Tomorrow's Headlines
7h 34min ago
Intel 18A yield gains raise pressure on Samsung foundry
Tomorrow's Headlines
7h 34min ago
May 26, 16:55
Nvidia and Marvell CEOs to share Computex stage— How US$2 billion turned rivals into partners
May 26, 17:18
Let there be limits—Pope Leo invokes scripture on AI's moral peril, Anthropic in tow
May 26, 14:00
Huawei Tau Law series 1: How China's chip industry is pivoting beyond Moore's Law
May 26, 17:54
Gogoro mourns backer Samuel Yin, who committed US$50 million before a single scooter rolled out
May 26, 10:32
Intel CEO Lip-Bu Tan Taiwan-bound for closed-door meetings ahead of Computex
LATEST STORIES
7 days news
Darfon Electronics invests in AI cooling systems maker GrAndvance
May 26, 17:19
ICT
LED maker Ennostar pivots to optical interconnects after high-value shift agin traction
May 26, 17:02
DISPLAYS
Alchip: ASIC growth may outpace the broader GPU market
May 26, 16:56
SEMICONDUCTORS
Inside China's chip war: How Xiaomi, BYD, and Nio are rewriting the rules
May 26, 16:31
EAST ASIA
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
Samsung's P4 HBM push could worsen DRAM crunch in 2027
Intel's Rio Rancho fab becomes test case for AI-era chip packaging
Commentary: Stellantis' capital shift signals quiet reshaping of Europe's auto industry
Wonderful Hi-Tech sees rising demand from low-orbit satellites and AI data centers
Kinpo Electronics pushes beyond manufacturing with AI servers, satellite systems, and quantum computing
Wiwynn expands US capacity as AI server boom strains power and supply chains
AMD and Nvidia deepen investments in Taiwan semiconductor ecosystem
E Ink brings BMW-backed color-changing e-paper car tech to Computex 2026
Win Semiconductors bets on optical and satellite communications growth
GlobalWafers rolls out phased GaN capacity expansion to ease supply crunch
Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
ASML expands Taiwan hiring and operations to meet advanced chip demand
Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
Kian-Shen reports 2025 revenue decline but eyes growth in electric bus chassis and sustainable transport
GlobalWafers to increase prices, targets 4Q26 shipments for square wafers, Asia capacity fully booked
SK Hynix moves cooling directly to D2D PHY to tackle rising HBM heat challenges
China pushes homegrown AI stack with local chips, LLMs
Taiwan's quantum research enters second phase, eyeing Finland for HPQC collab
Taiwan MLCC makers plug into AI server demand
Wingtech sues Nexperia for US$1.2B as it fights delisting risk
Holy Stone Enterprise says AI power surge will deepen global MLCC shortages
TP-Link India begins local manufacturing of Wi‑Fi 7, aiming to boost global supply
Micron expands US DDR4 output as AI keeps global supply tight
Lightmatter joins TSMC on COUPE for 3D optical engines
BIZ FOCUS
Apr 28, 08:00
AI anti-fraud solution wins virtual asset security hackathon
Monday 27 April 2026
Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
Monday 27 April 2026
SK hynix receives 2026 IEEE Corporate Innovation Award
Friday 24 April 2026
NewPower Named HPE 2026 Partner of the Year
MOST-READ
Agibot claims 100% success rate in factory deployment as humanoid race shifts to real-world validation
TSMC's COUPE push puts Samsung's silicon photonics ambitions under pressure
SK Hynix speeds Yongin fab buildout as memory crunch fuels capacity race
TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
AMD's 2nm defection to Samsung dents TSMC's AI grip
SMIC, Hua Hong form materials supply platform to cut China chip chain reliance on US
Memory supply gap stretches beyond 2028 as cloud capex tops US$725 billion
MULTIMEDIA
Pizza before pitches: how Taiwan's startups warmed up for Silicon Valley
Lisa Su's Taiwan Trip
AMD CEO Lisa Su visited Taiwan from May 20-23, 2026, following AMD's AI Development Day in Shanghai.
Analysis: Lisa Su moves on China — and Nvidia's CUDA moat
AMD's Lisa Su says memory is becoming another pressure point for AI chips
AMD's Lisa Su says AI demand is 'absolutely real' as CPUs return to focus
...More
EV
Tuesday 26 May 2026
Commentary: Stellantis' capital shift signals quiet reshaping of Europe's auto industry
Kian-Shen reports 2025 revenue decline but eyes growth in electric bus chassis and sustainable transport
Tuesday 26 May 2026
Japan's carmakers stopped fighting Chinese EVs — and started copying them
Tuesday 26 May 2026
BYD and Chery lead China's advance into Europe's EV market
Monday 25 May 2026
TECH
Tuesday 26 May 2026
Intel CEO Lip-Bu Tan Taiwan-bound for closed-door meetings ahead of Computex
Samsung averts strike with last-minute labor deal, but deeper divisions remain
Thursday 21 May 2026
How a cold call in 2013 led to TSMC's US$165 billion Arizona bet
Wednesday 20 May 2026
Samsung, SK Hynix face chipmaking chemical squeeze as China feedstock costs surge
Tuesday 19 May 2026
ASIA
Tuesday 26 May 2026
Inside China's chip war: How Xiaomi, BYD, and Nio are rewriting the rules
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
Tuesday 26 May 2026
Huawei Tau Law series 1: How China's chip industry is pivoting beyond Moore's Law
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027
Tuesday 26 May 2026
OPINIONS
Tuesday 26 May 2026
Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
Commentary: Stellantis' capital shift signals quiet reshaping of Europe's auto industry
Tuesday 26 May 2026
Analysis: Nvidia's Vera CPU opens new front in data center chip race
Tuesday 26 May 2026
Interview: Low-cost Chinese AI servers are redrawing the global infrastructure map
Monday 25 May 2026
TOPICS
LISA SU'S TAIWAN TRIP
HUAWEI
GEOWATCH
TSMC UPDATES
SPECIAL REPORTS
Tuesday 26 May 2026
The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
Mastering the 140%+ CAGR of CPO Semiconductor Revenue Explosion
Monday 25 May 2026
Taiwan, China wafer foundry industry, 2Q 2026: Cross-strait revenues to surge over 25%
Taiwan and China's wafer foundry industry off-season was not slow, and the price hike effect will drive up cross-strait industry revenues in the second quarter of 2026 and full-year 2026.
Monday 25 May 2026
From tech glasses to AI gateways: Smart eyewear becomes the entry point for AI agents
Lightweight and affordable smart glasses are gradually becoming popular, with related brands and third-party developers integrating AI agents onto the mobile devices.
Friday 22 May 2026
Taiwan broadband CPE industry, 1Q 2026: 10G upgrades drive volume but pricing pressures linger
Global broadband CPE shipments in the second quarter of 2026 are estimated to see a yearly growth of 3.4%, with PON CPE supporting shipment growth.
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