DIGITIMES: News and Insight of the Global Supply Chain

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VinFast aims to make India one of its two largest markets as overseas sales trail target

Oct 30, 15:31

ELECTRIC VEHICLES

Nvidia secures substrate capacity as FCBGA market targets US$27.3 billion by 2030

Oct 30, 15:00

SEMICONDUCTORS

BYD sees 28% profit growth for 3Q26, but still falls short of forecasts

Oct 30, 15:00

EAST ASIA

HHTD 26: Foxconn Chairman highlights processing and vertical integration strengths

Oct 30, 14:46

ICT

Jinpao targets power cabinets, BBUs in AI-related expansion

ASE expects packaging and testing margins to stay above 30%

Commentary: Why Marvell's rumored Lumentum buy may be hard to pull off but harder to pass up

KLA reportedly weighs India manufacturing entry as Semicon 2.0 opens to equipment makers

HyperAccel, Rebellions look beyond chips to AI data center systems

Nvidia dominates AI robot chips with 69% market share

Amazon 3Q26 earnings call: AWS targets 40%-plus growth through 2028 as satellite costs weigh on near-term profit

Nvidia weighs credit support for Nscale as data center, IPO face pressure

Sandisk sees 60–90GB of NAND per CPU in AI agent workloads

Delta Electronics approves Penang manufacturing base to expand global capacity

Trump targets foreign robotics imports under Section 232, citing national security risks

In-cabin sensing emerges as automakers' next value-added frontier

Doosan Enerbility expands AI power push with US gas turbine orders, next-gen nuclear

ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%

Sandisk says customers are coming back for more NAND

Dowoo Insys develops rollable OLED UTG for vehicles

HBM4 cycle faces squeeze as capacity, specs become critical

Luxury EVs face a status test, rivals retreat from full electrification

FCC to bar Chinese testing labs from certifying electronics for US market

Taiwan manufacturing demand rises as bank property loans decline

Episil-Precision fire hits under 10% of capacity, 6- and 8-inch lines to restart within two weeks

JPP Holding wins Airbus certification, targets A350 structural parts

STMicroelectronics rides AI and satellite demand, but margin recovery awaits fab overhaul

Anthropic's multi-platform AI strategy pressures Nvidia pricing power

CoreIntelligence sees in-car projection demand jump 60–70% in 2027

Power shortages slow AI data-center builds as Delta expands HVDC, SOFC

More news

BIZ FOCUS

Oct 30, 08:00

Macronix to Showcase Automotive and IoT Memory Solutions at electronica 2026

MOST-READ

MULTIMEDIA

K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue

According to DIGITIMES, Agentic AI, AI server expansion, cloud service provider (CSP) in-house CPU ramp-up, and replacement demand for general-purpose servers will lift global server CPU shipments to 52.6 million units in 2027, up 45.7% year-over-year, wi12_s.jpg

DIGITIMES says the most closely watched model in Apple's high-end iPhone 18 lineup, launched in September 2026, is the long-anticipated first foldable smartphone, the iPhone Duo.

DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to 25.951 million units, up 64.5% year-over-year.